HiPeR-AdPack Technology Development
Programme
                            GSTP
            Programme Reference
                            GT27-026MT
            Prime Contractor
                            AIRBUS DEFENCE & SPACE NETHERLANDS B.V.
            Start Date
                            End Date
                            Status
                            Closed
            Country
                            Netherlands
             
          Objectives
                            HiPeR (High performance Radiator) technology is a high performance, low cost, customizable and easily installable flexible film technology, based on pyrolytic graphite sheets. The objective of the proposed activity is to apply this technology (AdPack) in or on electronic boxes for satellites of launchers. 
Description
                            AdPack aims at both directly cooling components to the box structure and increasing the thermal conductivity of the box structure itself. By doing so the heat path of the component to the baseplate of the box will be improved by approximately 30%. 
To this end the following products are to be developed: 
- 
- HiPeR AdPack Strap to be applied as thermal interface between component and structure
- HiPeR AdPack doubler to be applied as directly to the structure to enhance its heat rejection capability.
 
The key characteristics of these products are: low cost, low mass, low complexity, high conductivity, highly adaptable and not constraining the AIT process.
;
The list of tasks that will be addressed in this activity are broken down as follows:
- 
- Trade-off between the best configuration to be implemented at equipment and component level: Strap, doubler clamped or bonded to the structure/component;
- Test definition: Defining a preliminary thermal calculation model and set of requirements;
- Manufacturing the test setup: power units, base plate, clamps ;and assembly of the HiPeR;
 
- Tests and thermal simulation;
Application Domain
                            Generic Technologies
            Technology Domain
                            21 - Thermal
            Competence Domain
                            2-Structures, Mechanisms, Materials, Thermal
            Initial TRL
                            TRL 3
            Target TRL
                            TRL 5
            Achieved TRL
                            TRL N/A
            