Manufacture reliability testing of non-hermetic (plastic) encapsulated devices
Programme
TDE
Programme Reference
T723-609ED
Prime Contractor
Alter Technology TUV Nord UK Limited
Start Date
End Date
Status
Closed
Country
United Kingdom

Objectives
To investigate feasibility, demonstrate production and obtain reliability data on plastic packaged devices, manufactured using a European supply chain.
Description
Plastic packaging is the most common packaging technology in commercial and automotive markets. The technology has evolved considerably, reducing the different failure modes initially associated with plastic packages. The apparition of Enhanced Plastic (plastic packages with added quality assurance requirements and extended testing is increasing the acceptability of these devices.
Proposals to use plastic packaging for flight components are becoming frequent for a variety of missions and programs, as the lower price (compared with traditional EEE packaging) of using plastic packages is highlighted as a method of reducing costs.
From the Quality Assurance point perspective, one of the main difficulties in accepting those components is the low visibility or reduced process controls that plastic packaging suppliers are willing to accept.
This activity will demonstrate the possibility and costs of packaging a "qualified" device (die) in a plastic package and subsequently test the packaged device to compare the performance and suitability for use in flight applications. A typical example device may be LM139, LM239 or device with similar complexity, history, cost availability.
ECSS-Q-ST-60-13C, accepts plastic components on a lot basis, after successful performance of the required test campaign. However, some of these tests could be reduced provided the basic processes are demonstrated to be under control at the packaging manufacturer.
This activity encompasses the following tasks:
- Identification of a European supply chain device to house in a plastic package.
- To manufacture plastic packages to create a suitable test piece.
- To define and implement manufacturing process controls for plastic packaging
- To perform relevant reliability tests according to ECSS-Q-ST-60-13C Class 1 devices and/or ESCC2566001.
- Definition of a Space PID
Application Domain
GEN-Generic Technologies
Technology Domain
23-Electrical, Electronic and Electro-mechanical (EEE) Components and Quality
Competence Domain
1-EEE Components, Photonics, MEMS
Initial TRL
TRL 2
Target TRL
TRL 4
Achieved TRL
TRL 7