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MOSFET Commercial plastic components survey and its SEE characterization

The aim of this activity is to:

Spain

20-D-S-TEC-05-e

ALTER TECHNOLOGY TUV...
R2D2 (Reliable Robust Dust Deflecting) Plug and Socket

To develop large-scale infrastructure on the Moon, many different systems will have to be shipped to the Moon to produce the necessary components. This means that the traditional design of systems cannot be assumed and a production machine cannot be expected to provide its own power especially when power demand is in the 100 kW – 1 MW range.

Luxembourg

20-D-T-TEC-03-e

MAANA Electric
Sub nano-g MEMS accelerometer for high precision orbital manoeuvres

The inertial navigation market has a need for accelerometers with high sensitivity, low noise, low cost and low power consumption. ESA has identified high accuracy accelerometer units as a priority in a 2019 roadmap. The current state of art products are not able to deliver. Here we introduce a novel accelerometer design, using concepts originally developed for gravitational wave detector physics, which will enable an accelerometer to meet these requirements.

The Netherlands

ETD 2020-07-d

Innoseis
Battery-Less Low Temperature Avionics and System Study

Many types of science missions focus on Solar System targets with harsh thermal environments, such as Mars, the Moon, asteroids, comets, and other bodies at the fringes of the Solar System. Traditional spacecraft avionics rely on the storage of electrical energy in electrochemical systems (typically secondary batteries) for covering peak energy demands and periods where no electrical energy is generated (Lunar/Martian/cometary night, etc.).

Belgium

15/002

SPACE APPLICATIONS SERV...
Radiation-hardness components at scaled technology nodes – test of single-events effects in ARM Cores (ARIADNA)

The main goal of this Ariadna study was to determine the radiation hardness of potential future space processors. The AR0 test-chip was used to study the impact of SEUs and SETs on different versions of a hardened processor on UTBB-FDSOI 28nm technology, including DICE flip-flops, and three different hardening level of combinational logic.

Canada

15R4

University of...

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