3D Honeycomb for curved structure manufacturing
Programme Reference
G61A-009MS
Status
Closed
Country
Luxembourg
Start Date
2018
End Date
2022
Programme: GSTP Prime Contractor: EURO-COMPOSITES S.A.
Objectives
The primary objective of this activity is to demonstrate the added technological and manufacturing values using 3D type of honeycomb structure on the manufacturing process of all curved composite structures based on honeycomb core.
Description
3D honeycomb is foreseen to drastically facilitate the manufacturing of all complex curved and bi-dimensional panels, fairing, mast and booms, antenna reflectors and sub-reflectors, telescope mirrors and re-entry vehicles. The following tasks will be performed: Review of all space (sub)systems that are using curve structure based on honeycomb including launchers, telecommunication and structure application in general.Development of materials to answer all type of application (i.e. Space grade Aluminium, Fibre reinforced resin).Trade-off and selection of 3 systems/structure that will show an increase in productivity, functionality and reliability when using 3D honeycomb (i.e antenna, fairy, boom) compare to system using classical honeycomb and splicing process.Production of 3D honeycomb (metal and polymer).Planning for detailed design, manufacturing, and testing for full space qualification.Manufacturing and testing for space related performance and model optimisation.Manufacturing of demonstrator/breadboard and full testing and model evaluation.Critical revision of 3D honeycomb based structure and eventual manufacturing process modification.
• Application domain: Generic Technologies
•
Technology Domain:
20 - Structures
24 - Materials and Manufacturing Processes
20 - Structures
24 - Materials and Manufacturing Processes
•
Competence Domain:
2-Structures, Mechanisms, Materials, Thermal
2-Structures, Mechanisms, Materials, Thermal
• Initial TRL: TRL 4
• Target TRL: TRL 6
• Achieved TRL: TRL 6
•HarmoRoadMap: Composite Materials (2014.2)
•IPC Document: ESA/IPC(2016)61
•Public Document: