Industry pushes towards higher operation temperatures of diodes while reducing cost. SiC technology with plastic packaging offers promising results able to match these requirements. Some applications (i.e. spaceship solar arrays) requirements are as high as 250°C. This application was considered as potential target application for the project test units designed.

Three different device types were designed, manufactured, and tested in the frame of the project using well known SiC Schottky dies, three mould compounds and two die configurations:

• Type 1: Single die QFN32 5x5 with Mould 1
• Type 2: Twin die (common cathode) QFN64 9x9 Mould 2
• Type 3: Twin die (common cathode) QFN64 9x9 Mould 3