109 results found Selected 0 items No itemsClear selection Select / deselect all results (all pages, 109 total) GR740 Next Generation Microprocessor Flight Models (NGMP Phase 3) The Next Generation Microprocessor and associated SW infrastructure has been developed under various TRP activities starting in 2006. Prototypes in ST Microelectronics C65SPACE 65 nm technology have been manufactured in 2015 under the product code GR740. Prototypes and evaluation boards have been made available to end users as of Q2/2016. The GR740 has been extensively validated with functional, electrical and radiation testing throughout 2016, several anomalies have been found in the design and in the technology library. Sweden GSTP G617-273ED COBHAM GAISLER AB 2017 - 2021 GR740 Next Generation Microprocessor Flight Models (NGMP Phase 3) Utilisation of a Heavy and Light Ion Facility at UCL for Component Radiation Studies This activity concerns execution of regular irradiation test campaigns on EEE components for flight on ESA and European space missions. Up to 360 hours per year of beam time is available free of charge on a priority basis for ESA. Additionally, a minimum of 500 hours per year is available for ESA sub-contractors, research institutes and other interested users at preferential hourly rates. The agency provides the facility with a detailed work programme of the test campaigns. Subsequently, the facility performs test campaign scheduling (in agreement with the Agency). Belgium TDE T723-F09QE Universite catholique de Louvain 2018 - 2021 Utilisation of a Heavy and Light Ion Facility at UCL for Component Radiation Studies Planar and encapsulated SMD inductive electronic component qualification It is proposed to develop and optimize encapsulation technology for the transformation of traditional Through Hole Mount electronic inductive components into Surface Mount Technology. This will involve the development and industrialization of encapsulation process and the development of mechanical elements for the integration of traditionally applied geometries of inductive components. The proposed activity is a continuation from a GSTP 4 activity (G604-11EP Study). The goal of that activity was to assess materials and technologies related to a series of planar inductive components. Denmark GSTP G617-243QT FLUX A/S 2017 - 2021 Planar and encapsulated SMD inductive electronic component qualification Quality Assessment of the new European Large BRAVE FPGA Software Tools (Queens) FPGA are increasingly being used to implement complex and critical functions on-board satellites at both platform and payload level, for a diverse range of applications, including: micro-controller processors, data compression, image data processing and others. The new European Space BRAVE FPGA is being developed in various sizes and offering various complex functionality. Spain TDE T725-601QQ GMV AEROSPACE AND DEFENCE, SA 2019 - 2021 Quality Assessment of the new European Large BRAVE FPGA Software Tools (Queens) Improved thermal management capability of power semiconductors The ESA-EC FP7 coordinated project AGAPAC (Advanced GaN Packaging) was completed in 2012 and has been highly successful. The aim of AGAPAC was to demonstrate advanced packaging concepts using MDC with improved thermal dissipation capability that can allow the full performance advantages of GaN technology to be realized. In addition, a consecutive TRP activity, ?High dissipative material for LF/RF hermetic hybrids?, was run and meant to assess different materials (e.g. AlSi, CMC, CuD) developed for realizing high dissipative packages. Austria GSTP G617-123QT RHP-TECHNOLOGY GMBH 2016 - 2020 Improved thermal management capability of power semiconductors COOL ? Compact Optical clOck Laser Optical atomic clocks are based on using lasers to measure very narrow and stable atomic transitions. Narrow refers to the fact that only a limited range of optical frequencies can be used to excite/measure the transition in the atom. ;For the target space based optical clock, this requires the laser frequency to be controlled to approximately one part in a trillion. ; Switzerland GSTP GT27-017MM MicroR Systems 2020 - 2020 COOL ? Compact Optical clOck Laser De-risk assessment: D-COLTS: De-risking Compact Laser Technologies for Strontium Project D-COLTS de-risked and progressed the development of laser systems required for strontium-based optical frequency standards to be used in the next generation of global positioning systems (GPS) and for precision metrology such as atom interferometry for gravitational field measurements. The laser systems require an increase in TRL in order to support future missions. United Kingdom GSTP G617-241TAde FRAUNHOFER UK RESEARCH LIMITED 2019 - 2020 De-risk assessment: D-COLTS: De-risking Compact Laser Technologies for Strontium Control ASIC for Earth Observation Infrared Detector Array Hybrid infrared detector arrays combing a sensitive diode layer bonded to a CMOS readout circuit are baselined for many current and upcoming Earth Observation missions. This activity aims to develop a breadboard, using a custom ASIC, capable of providing the necessary clocks and bias voltages to operate the detector as well as providing 4-channel video processing and digitisation, leading to a two-chip (Control ASIC + hyrbid detector) detection system. The design will be split to allow separate or combined use of bias and clock generation and video processing and digitization functions. Norway TDE T117-503MM INTEGRATED DETECTOR ELECTRONICS AS 2018 - 2020 Control ASIC for Earth Observation Infrared Detector Array Battery-Less Low Temperature Avionics and System Study Many types of science missions focus on Solar System targets with harsh thermal environments, such as Mars, the Moon, asteroids, comets, and other bodies at the fringes of the Solar System. Traditional spacecraft avionics rely on the storage of electrical energy in electrochemical systems (typically secondary batteries) for covering peak energy demands and periods where no electrical energy is generated (Lunar/Martian/cometary night, etc.). Belgium Discovery 15/002 SPACE APPLICATIONS SERV. S.A./N.V 2017 - 2020 Battery-Less Low Temperature Avionics and System Study Microcontroller for embedded space applications: Specification and design verification As pointed out during the round table on Microprocessors for Space Applications (ADCSS09) the need for a reduced cost and highly integrated microcontroller for low-end space applications is strong. The obsolescence of the 80c51 is creating a hole not filled by the available high-end microcontrollers like the AT7913E.This type of applications implies a reduced component price, a small and easy to be assembled low pin-count package (not BGA) and (monolithic) integration of essential system components (e.g. Sweden TDE T701-317ED COBHAM GAISLER AB 2014 - 2020 Microcontroller for embedded space applications: Specification and design verification Pagination « First First page ‹‹ Previous page … 3 4 5 6 7 8 9 10 11 ›› Next page Last » Last page Filter by Programme TDE (61) GSTP (36) Discovery (11) Preparation (1) Filter by Start Year 2020 (18) 2021 (15) 2014 (10) 2018 (10) 2019 (8) 2022 (8) 2015 (6) 2016 (6) 2012 (5) 2013 (5) 2023 (5) 2011 (4) 2009 (3) 2017 (3) 2008 (2) 2010 (1) Filter by End Year 2023 (25) 2024 (21) 2019 (10) 2021 (8) 2017 (7) 2020 (7) 2018 (6) 2016 (5) 2022 (5) 2025 (5) 2014 (3) 2011 (2) 2012 (2) 2010 (1) 2013 (1) 2015 (1) Filter by Keywords 28-Electronic Components (6) 15-Technologies applicable to several Cosmic Vision Missions (4) 2-Optical Payloads (3) 30-Deep Sub Micron Development (3) 1-On-board Data Systems (2) 3-Space Segment - Payload (2) 36-Collaborative Activities (2) COTS (2) 0-Navigation (1) 1-Avionics and Processing (1) 1-Onboard Data Systems (1) 2-New Space Transportation Services (1) 4-Spacecraft Environment & Effects (1) 5-Space System Control (1) 9-Technologies applicable to several Cosmic Vision Missions (1) 17-Optoelectronics (1) 31-Miniaturisation (1) 40-Design to Produce (1) accelerometer (1) Ariadna (1) ARM Cores (1) Battery (1) battery-less (1) BLDC (1) Communication (1) DeepCube (1) Distributed optical fibre sensors (1) DOFS (1) EEE component (1) EMC (1) Energy Storage (1) frequency-combs (1) GaN transistors (1) gravity waves (1) LEO (1) Liquid Crystal (1) low temperature (1) magnetic shielding (1) MEMS (1) millimeter-wave applications (1) MOSFET (1) photonic integrated circuits (1) PICS (1) Processors (1) quantum sensors (1) Radiation (1) Satellite (1) Filter by Contractor ALTER TECHNOLOGY TUV NORD S.A. 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