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Evaluation of heatshield CFRP and bonding materials to increased temperature limits

Programme
TDE
Programme Reference
T924-004MT
Prime Contractor
ACONDICIONAMIENTO TARRASENSE ASSOCI
Start Date
End Date
Status
Closed
Country
Spain
Objectives

The objective is to screen, trade-off and characterise existing CFRP substrate materials (including honeycomb structures) as well as bonding materials and processes suited for the attachment of an ablative TPS for an increased temperature limit of at least 250degC at the TPS/structure interface.

Description

OOne important constraint in the sizing process of an ablative TPS for atmospheric entry vehicles is the temperature limit of the supporting heatshield structure and of the bonding material used to attach the TPS. This temperature limit is typically in the range of 150-180degC. For the CFRP the limiting factor is typically the resin. New resin materials (like cyanate ester or bismaleimide) have commercially become available in recent years and relevant CFRP materials been qualified towards higher temperature limits for other space applications (like solar arrays or antenna reflectors). Such increased limits would allow to reduce the required TPS thickness and therefore to reduce the mass of the TPS. The objective of the activity shall be achieved through the following steps:- Perform a market research of advanced CFRP based on relevant new resin materials as well as bonding materials for the attachment of the TPS suited for increased temperatures - Perform a trade-off (including relevant screening tests) - Develop and test a selected CFRP material as well as a TPS bonding material to achieve an operational temperature of at least 250degC, while meeting atmospheric entry vehicle requirements.

Application Domain
Exploration
Technology Domain
24 - Materials and Manufacturing Processes
Competence Domain
2-Structures, Mechanisms, Materials, Thermal
Keywords
1-Phootprint
Initial TRL
TRL 3
Target TRL
TRL 4
Achieved TRL
TRL 4
Public Document