This project proposes to characterise, manufacture and test the use of thin ply technologies to assess their compatibility with known space materials, evaluate their suitability for typical processing (use of inserts, doublers etc) for space applications and determine the performance improvements achieved using this processing technology. System level benefits shall be assessed both in terms of performance gains as well as cost impact.

 

 

A number of companies and institutes have been developing carbon fibre composite thin ply technologies primarily for use in the high end composite market associated with certain marine and automotive sporting activities (formula one, Americas cup rigid sails etc.). Thin ply technologies utilise a process to spread tows of fibres to make ultra thin unidirectrional prepreg tapes that allow a reduction in the fibre weight from typically 120-150gsm (grammes per square metre) to around 30gsm using the M55J 6k fibres. In addition, the development of thinner plies enables the layup of a more complex multidirectional composite skin compared to conventional CFRP laminates. Processing of these composites as thinner laminates also enables a reduction in manufacturing defects such as resin porosity (due to shorter diffusion paths) again with an associated performance improvement. The reduced areal weight coupled with improved mechanical performances achieved by the use of thin plies using conventional materials already familiar to the space industry offers an opportunity to develop and utilise a technology whilst retaining the historical heritage already known from the materials previous use.

In particular, in this activity the following tasks will be performed:

• Evaluate the spin-in of carbon-fibre thin ply technology for use in the space domain on structures such as antennas, solar array, structural panels.

• Quantify the improvements in terms of specific strength and stiffness of thin laminates wrt existing typical laminate configurations.

• Investigate the suitability of the technology for processing and manufacturing with high modulus fibres.

• Assess the manufacturing requirements for use and processing of the thinply technology.

• Manufacture and evaluate laminate and sandwich level coupons to quantify the suitability of the technology for space use.

• Assess machinability for the inclusion of inserts, doublers, feed through holes and other design features.

• Assess the suitability of the technology for bonding to doubler or other features.

• Manufacture and test a demonstrator sandwich panel containing a range of the above design characters to a configuration which could be proposed as an alternative for a specific subassembly and demonstrate the improved performance.

Phase 1: 300 k? with characterisation of the matured technology.

Phase 2: 400 k? breadboarding of the technology to address relevance for end user applications.