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Evaluation of lighter and more efficient radiation protection for electronic and sensitive parts.

Programme
GSTP
Programme Reference
G617-130QT
Prime Contractor
HPS GMBH
Start Date
End Date
Status
Closed
Country
Germany
Evaluation of lighter and more efficient radiation protection for electronic and sensitive parts.
Objectives
  • Manufacture and evaluate the multi-layered shielding technology for use in space applications: replacement of currently used boxes (aluminium) for radiation protection and improvement of protection of currently used boxes by adding this multi-layer shielding.
  • Assess the machinability of the technology.
  • Assess the suitability of the technology for bonding on typical substrates used for electronic boxes.
  • Investigate the suitability of the technology for the processes involved in manufacturing boxes for radiation protection.Investigate the suitability of the technology for the processes involved in integration (AIT) activities.
  • Manufacture a demonstrator and perform an evaluation test campaign to assessthe effects of the relevant environment (vacuum, thermal cycles, radiation).
 
 
Description
Radiation shielding mainly depends on particles species and energies: a multi- layered shielding approach could therefore be seen as the most effective shielding at the lowest mass. In previous studies, it was observed that a potential gain of 40% to 50% in shielding effectiveness with respect to Aluminum shielding (at equivalent mass) could be achieved with materials like Tantalum, Polyethylene- Tantalum, Polyethylene-Tungsten and Kapton-Tungsten. While the manufacturing is technically easy to realise as there is no real TRL problem foreseen, the best materials have to be identified and mature enough manufacturing processes have to be set so that a solution can easily be implemented on S/C. Activities will aim at applications for different phases of satellite integration:
 
  • Replacement of aluminium boxes: identify materials and processes to manufacture boxes to protect electronics or sensitive hardware, with all the associated processes (as drilling, bonding...).
  • Rework activities on electronic boxes already manufactured: for shielding improvement at later stage of the project. Activities to obtain a finished product that is easy to handle during AIT activities, bonding procedures on aluminium boxes, other fixation processes.
 
Preliminary qualification tests will also have to be performed to evaluate aging of all the processes.
 
This activity will be divided in 2 phases:
 
  • 1st phase:
  • Trade-off analysis of the available materials based on definition of key properties. The trade-off shall include manufacturing and reworkability processes, radiation protection efficiency.
  • Manufacturing of breadboards with different candidate materials? Preliminary testing of candidate materials (radiation, mechanical, thermal) to choose the best candidate.
  • Evaluation of candidates.
 
  • 2nd phase:
From phase 1, selection of 1 or 2 most promising candidates manufacture:
  • Manufacturing of demonstrator.
  • Testing and characterisation of the demonstrator: functional, mechanical and thermal characterisation, vibration, shock and EMC tests.
 
 
 
 
Application Domain
Generic Technologies
Technology Domain
24 - Materials and Manufacturing Processes
Competence Domain
2-Structures, Mechanisms, Materials, Thermal
Initial TRL
TRL 2
Target TRL
TRL 5
Achieved TRL
TRL 5
Public Document