High Density Interconnect Technology and Thermount replacement with assembled devices.

To evaluate, within well-defined process parameters at least 1 PCB manufacturer and assembly company, the HDI technology in combination with low CTE laminate and assembled devices.

High Density Interconnect (HDI) technology entails miniaturisation of Surface Mounted Device (SMD) pads, tracks and microvias, which is already available technology for commercial market. Space market currently only uses more conservative larger dimensions for PCB routing and components. HDI is strongly driven by the decreasing pitch due to miniaturisation of available components. Denser population of PCBs leads to mass reduction. Typical HDI components are ceramic and, therefore, require the use of a low Coefficient of Thermal Expansion (CTE) laminate, such as the obsolete Thermount. Reliability of assembly and smaller routing are issues to be evaluated. Design rules shall be evaluated and an evaluation programme shall be performed on bare boards followed by assembled boards.