Manufacturing, test development and evaluation of a monolithic, rad-hard ECM LVDS component family
Programme
GSTP
Programme Reference
GT17-428MM
Prime Contractor
SPACE IC GMBH
Start Date
End Date
Status
Closed
Country
Germany
Objectives
The objective of this activity is to prepare an ECM (Enhanced Common Mode) LVDS (Low Voltage Differential Signalling) component family for ESCC qualification.
Description
The part component family is represented by the SPLVDS032RH and SPLVDS031RH, which are radiation hardened 400 Mbps Quad LVDS line receiver and line driver, correspondingly, and the SPLVDS104RH, which is a radiation hardened 800 Mbps 1:4 LVDS Fanout buffer. All these 3 components are optimised for high-speed, low power, low noise transmission over controlled impedance transmission media (e.g. cables, printed circuit board traces, backplanes).
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An ECM LVDS family has been developed in previous activities, with wafer material already available for production purposes. This prepares the technology for lot manufacturing (assembly) and Single Phase Qualification of the whole component family, which is planned to be subject of a subsequent activity.
In particular, the following tasks are foreseen:
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- perform evaluation testing for the base component types line receiver, line driver and Fanout buffer,
- develop the final ATE (Automated Test Equipment) test solutions for the base component types line receiver, line driver and Fanout buffer,
- enable and execute wafer testing and dicing of the further component types line receiver, line driver and Fanout buffer,
finalise the assembly process setup for all component types and approval of the PID (Process Identification Document) (including line survey and audit).
Application Domain
Generic Technologies
Technology Domain
OTHERS
Competence Domain
1-EEE Components, Photonics, MEMS
Initial TRL
TRL 4
Target TRL
TRL 5
Achieved TRL
TRL 5