Reliability of Lead free/pure tin component terminations

To confirm the reliability of lead free and pure tin components mounted with a suitable lead free process to Printed Circuit Boards, by exposing them to a harsh testing regime in line with launcher environment and requirements 

Currently, the space industry as a whole is facing increasing pressure from customers and environmental lobbyists and supply chains, to reduce or eliminate the use of lead. Pressure is also increasing to reduce the cost of electronic components and equipment used on launch vehicles. An approach to using lead free components has been written deployed. The document No. VG-SG-1-D-0032-SYS describes steps the steps required to enable the use and delivery of equipment using a variety of components including lead free or pure tin terminations. An existing design of an electronic equipment PCB/equipment shall be selected with a suitable selection of component types and finishes. A number of items will be produced using an established process, and subsequently electrical, mechanical and environmental testing shall be carried out. Following completion of the manufacturing and testing, analysis will be performed to identify issues, failures and weaknesses exposed by the preceding activities.