As pointed out during the round table on Microprocessors for Space Applications (ADCSS09) the need for a reduced cost and highly integrated microcontroller for low-end space applications is strong. The obsolescence of the 80c51 is creating a hole not filled by the available high-end microcontrollers like the AT7913E.This type of applications implies a reduced component price, a small and easy to be assembled low pin-count package (not BGA) and (monolithic) integration of essential system components (e.g.

N/A

The general approach while designing a Reconfigurable Avionics will follow the general principles: - Implementing by default most of the functions as SW - Using (slave) reprogrammable FPGA(s) as an accelerator to implement too CPU intensive functions - Providing a scalable and versatile I/O system supported by flexible SW drivers - Extending digital I/Os by Analogue Front-ends The selected hardware platform is the combination of a powerful microprocessor and one or several high-end reconfigurable FPGAs, fulfilling the following needs: - Supporting exploratory and evolutionary designs accord

The Arctic Mission System Study involved two parallel studies conducted by consortia led by OHB Sweden and Thales Alenia Space. The scope of the studies were to identify needs in the Arctic region that could be met with mission architecture containing space elements, to propose such mission architectures, to define the elements of one of the architectures in some detail and to propose a plan to implement it.

n/a

High Density Interconnect (HDI) technology entails miniaturisation of Surface Mounted Device (SMD) pads, tracks and microvias, which is already available technology for commercial market. Space market currently only uses more conservative larger dimensions for PCB routing and components. HDI is strongly driven by the decreasing pitch due to miniaturisation of available components. Denser population of PCBs leads to mass reduction. Typical HDI components are ceramic and, therefore, require the use of a low Coefficient of Thermal Expansion (CTE) laminate, such as the obsolete Thermount.