63 results found Selected 0 items No itemsClear selection Select / deselect all results (all pages, 63 total) De-risk assessment: Generic flexible Nanosat platform for IOD and IOV services - Scenario 3 Future CubeSat platforms for IOD/IOV missions will require improved capabilities at an equal or reduced price as currently available platforms. Two important drivers for such a platform are computational power and flexibility to adapt to different missions. OroraTech has developed a computational powerful processing unit, in form of a GPU and a new modular and flexible bus architecture, called SmartPanels, for this purpose. Equipped with this technology, OroraTech will enter the IOD/IOV market. Germany GSTP G617-241TAdu Orbital Oracle Technologies GmbH 2020 - 2021 De-risk assessment: Generic flexible Nanosat platform for IOD and IOV services - Scenario 3 Improved thermal management capability of power semiconductors The ESA-EC FP7 coordinated project AGAPAC (Advanced GaN Packaging) was completed in 2012 and has been highly successful. The aim of AGAPAC was to demonstrate advanced packaging concepts using MDC with improved thermal dissipation capability that can allow the full performance advantages of GaN technology to be realized. In addition, a consecutive TRP activity, ?High dissipative material for LF/RF hermetic hybrids?, was run and meant to assess different materials (e.g. AlSi, CMC, CuD) developed for realizing high dissipative packages. Austria GSTP G617-123QT RHP-TECHNOLOGY GMBH 2016 - 2020 Improved thermal management capability of power semiconductors Securing NG-Ultra FPGA development through innovative System-on-a-Chip (SoC) validation The BRAVE series of reprogrammable FPGA’s represent an entirely new area of development for microelectronics. These high performance, very advanced electronics could revolutionise the manufacturing process and performance of multiple missions. Alongside their development there is a current industry initiative to standardise avionics systems. As part of this venture, GSTP Element 2 has initiated an activity to develop a standardised box, which will contain all the different computer modules, such as power boards, and ensure they are all compatible. France GSTP GT27-046ED AIRBUS DEFENCE AND SPACE SAS 2019 - 2020 Securing NG-Ultra FPGA development through innovative System-on-a-Chip (SoC) validation Battery-Less Low Temperature Avionics and System Study Many types of science missions focus on Solar System targets with harsh thermal environments, such as Mars, the Moon, asteroids, comets, and other bodies at the fringes of the Solar System. Traditional spacecraft avionics rely on the storage of electrical energy in electrochemical systems (typically secondary batteries) for covering peak energy demands and periods where no electrical energy is generated (Lunar/Martian/cometary night, etc.). Belgium Discovery 15/002 SPACE APPLICATIONS SERV. S.A./N.V 2017 - 2020 Battery-Less Low Temperature Avionics and System Study Development of a high energy beam combination, ions and electrons, for radiation test of electronic components The test of electronic components under radiation is becoming increasingly difficult because of denser and more complex packaging of the state-of-art components, such as microprocessors, memories, FPGAs, packaged in plastic, ceramic or Flip- chip configurations.This implies a larger beam range of the irradiation beam combinations, in order to reach the active and radiation-sensitive semi-conductor die of the component. The larger beam range is obtained with a high energy beam combination. Finland GSTP G617-156QE UNIV JYVASKYLA 2014 - 2020 Development of a high energy beam combination, ions and electrons, for radiation test of electronic components Compact impedance matched connectors for SpaceWire Links Development and ESCC Evaluation At present there are few European compact connector solutions that offer performances required for high speed operation of SpaceWire as well as meeting the stringent environmental requirements in space applications. The ECSS E-ST-50-12C defines the connectors and cables to be used on a SpaceWire Cable Assembly, respectively as per ESCC 3401/071 and ESCC 3902/003. Recent developments done under the frame of an ESA TRP activity lead to the definition of new cable variants allowing noticeable mass saving, compared to the current variant of the ESCC 3902/003. United Kingdom TDE T708-411QT AXON' CABLE LTD 2015 - 2019 Compact impedance matched connectors for SpaceWire Links Development and ESCC Evaluation 16-bit ADC The main tasks will be:-design-Foundry-Test of performances with existing CMOS detectors-Radiation tests Spain TDE T723-304QT ALTER TECHNOLOGY TUV NORD S.A. 2013 - 2019 16-bit ADC Electrosprayed Metal-nanoparticle-Metal (eMIM) capacitor for energy storage There is a clear need for developing more performant energy storage components for space in terms of specific energy (Wh/kg) or the specific power (kW/kg). ; Spain TDE A02017146 ACONDICIONAMIENTO TARRASENSE ASSOCI 2018 - 2019 Electrosprayed Metal-nanoparticle-Metal (eMIM) capacitor for energy storage Flight data analysis of TDP#8 radiation experiment on board Alphasat Under a previous ESA contracts a combined component technology demonstration and component radiation effects experiment in addition to a radiation environment instrument was designed, developed and manufactured. This equipment consists of a Component Technology Test Bed (CTTB) and the radiation monitoring instrument MFS. The first flight model, named Technology Demonstration Payload#8 (TDP#8), is currently flying on Alphasat since July 2013. The CTTB contains three radiation effects experiments. Portugal GSTP G617-146QE EFACEC 2015 - 2019 Flight data analysis of TDP#8 radiation experiment on board Alphasat Radiation-hardness components at scaled technology nodes – test of single-events effects in ARM Cores (ARIADNA) The main goal of this Ariadna study was to determine the radiation hardness of potential future space processors. The AR0 test-chip was used to study the impact of SEUs and SETs on different versions of a hardened processor on UTBB-FDSOI 28nm technology, including DICE flip-flops, and three different hardening level of combinational logic. Canada Discovery 15R4 University of Saskatchewan 2016 - 2019 Radiation-hardness components at scaled technology nodes – test of single-events effects in ARM Cores (ARIADNA) Pagination « First First page ‹‹ Previous page 1 2 3 4 5 6 7 ›› Next page Last » Last page Filter by Programme GSTP (22) Discovery (21) TDE (19) Preparation (1) Filter by Start Year 2021 (17) 2020 (12) 2018 (6) 2022 (5) 2015 (4) 2016 (4) 2019 (4) 2023 (4) 2014 (3) 2017 (3) 2013 (1) Filter by End Year 2023 (26) 2021 (10) 2024 (8) 2019 (6) 2022 (5) 2020 (4) 2025 (2) 2016 (1) 2018 (1) Filter by Keywords 28-Electronic Components (4) 3-Space Segment - Payload (3) 32-Clean Space (2) COTS (2) 1-Microwave Payloads (1) 36-Collaborative Activities (1) accelerometer (1) amorphous silicon (1) Ariadna (1) ARM Cores (1) Battery (1) battery-less (1) BLDC (1) Distributed optical fibre sensors (1) DOFS (1) EEE component (1) EMC (1) Energy Storage (1) GaN transistors (1) gravity waves (1) ISRU (1) low temperature (1) Lunar power (1) magnetic shielding (1) MEMS (1) millimeter-wave applications (1) Moon base (1) moon plug (1) Moon solar power (1) MOSFET (1) Off-Earth manufacturing (1) photonic integrated circuits (1) PICS (1) Processors (1) quantum sensors (1) Radiation (1) space-grade polyimide (1) SPS (1) Filter by Contractor IMEC VZW. 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