1 results found Select / deselect all results (all pages, 1 total) Survey PCB techniques for high dissipative components In terrestrial electronics, a number of technological solutions have been developed and verified to allow direct (power) SMD EEE components mounting on PCBs with very good thermal conduction properties to the applicable thermal sink/baseplate.There are different principles (from rather basic - Insulated Thermal Substrates to Filled Thermal Vias, combination of Microvias and Buried Vias - to advanced approaches - including micro heat pipes embedded in PCBs).See for example the information provided at the following web links:a. Belgium TDE T703-402EP THALES ALENIA SPACE BELGIUM 2016 - 2021 Survey PCB techniques for high dissipative components Filter by Programme TDE (1) Filter by Start Year 2016 (1) Filter by End Year 2021 (1) Filter by Keywords (-) 36-Collaborative Activities (1) Filter by Contractor THALES ALENIA SPACE BELGIUM (1) Filter by Country Belgium (1) Filter by Application Domain Generic Technologies (1) Filter by Technology Domain 3 - Space Systems Electrical Power (1) Filter by Competence Domain 2-Structures, Mechanisms, Materials, Thermal (1) Filter by Activity Status Closed (1)
