The main objective of the project was to select the right IMU for our Future GNSS Receiver Unit (GRU). Two IMU were selected from their datasheet : µ-UMI-IC-HP from Litef and STIM318 from Sensonor. These 2 IMU were submitted to hard characterization tests applicable to our Launchers (and
HAPS) application.

Time-to-Digital Converters (TDCs) are crucial elements in many sensor readout systems, such as time-of-flight sensors, laser ranging devices, LiDAR, ultrasonic sensors, particle detectors, etc. To the best of our knowledge, there is currently no rad-hard TDC component available on the market, which could meet the targeted specification defined in this project. The goal of this project is prototyping and lab testing of a radiation-hardened single-chip picosecond TDC in a commercial 65 nm CMOS technology.

TAS-B has high heritage on PPU for HET ranging from 1,35 kW up to 4,5 kW. In the frame another project, TAS-B  develops New Space PPU modules to drive thrusters in the same power range, for platforms with 100 V regulated power bus. In the frame of the project “BBK for Low Power PPU”, TAS-B addresses the low range of the New Space market: smaller thrusters for smaller platforms with lower unregulated bus.

Remote detection and mapping of floating marine plastic litter (FMPL) from space needs to operate in synergy with clean up actions. This implicates that an observation system is needed combining high revisit and high spatial resolution. Currently there is no single remote sensing technology with sufficient revisit capabilities and spatial/spectral resolution relevant to FMPL dynamics. Therefore a combination of small drones, satellites and High Altitude Pseudo-Satellite (HAPS) is anticipated to provide the long term sustainable technical solution.

The design of a re-entry vehicle and the analysis of its performance are extremely challenging tasks. The difficulties increase when the understanding of its transient behaviour is sought and grow even further if this transient is affected by uncontrolled phenomena such as the shape change caused by the ablation of the thermal protection material used as heat shield.

In terrestrial electronics, a number of technological solutions have been developed and verified to allow direct (power) SMD EEE components mounting on PCBs with very good thermal conduction properties to the applicable thermal sink/baseplate.There are different principles (from rather basic - Insulated Thermal Substrates to Filled Thermal Vias, combination of Microvias and Buried Vias - to advanced approaches - including micro heat pipes embedded in PCBs).See for example the information provided at the following web links:a.