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Evaluation of Spin-transfer Torque DDR MRAM in Space Environment

Programme Reference

20-D-T-TEC-05-h

Status

Closed

Country

France

Start Date

2021

End Date

2024

Programme: Discovery Prime Contractor: THALES ALENIA SPACE FRANCE

Subcontractors:
ALTER TECHNOLOGY TUV NORD FRANCE SAS • France
TRAD – Test et Radiations • France

Description

MRAM (Magnetic Random Access Memory) technology is very interesting for space use since: MRAM could replace both non-volatile memories (EEPROM, NOR & NAND Flash, …) and volatile memories due to its fast writes (SRAM or even DRAM…) MRAM technology has a very high endurance (>1e10 cycles when Flash and EEPROM technologies are limited to about 10 000 or 100 000 cycles) MRAM technology is known to have a good withstanding in TID, to have a memory cell SEU immune and some MRAM from EVERSPIN technologies are already SEL immune. All MRAM evaluated here are in Spin-Transfer Torque technology (STT-MRAM) using deep-submicron nodes. This Everspin’s newest MRAM technology use the spin torque transfer property, which is the manipulation of the spin of electrons with a polarizing current, to establish the desired magnetic state of the free layer to program, or write, the bits in the memory array. STT-MRAM provides a significant reduction in switching energy compared to Toggle MRAM, and is highly scalable, enabling higher density memory products. This third generation of MRAM technology uses a Perpendicular MTJ (Magnetic-Tunnel Junction). These products perform like a persistent DRAM but with no refresh required.

• Application domain: Generic Technologies

•
Technology Domain:
01 - On-board Data Subsystems
• Initial TRL: TRL N/A • Target TRL: TRL N/A • Achieved TRL: TRL N/A

•Public Document:

Executive Summary
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Evaluation of Spin-transfer Torque DDR MRAM in Space Environment