Design, manufacture and fabricate a custom readout integrated circuit for a large-format visible hybrid detector array.

 

CMOS image sensors offer new possibilities for imaging and spectral applications with fast, flexible readout. They are typically available in two formats - monolithic and hybrid. While monolithic is more common and easier to fabricate, the performance is to some extent dictated by the available manufacturing process. Hybrid image sensor technology, however, offers the ability to independently customise the performance of both the readout circuit (ROIC) and the detection layer from UV to NIR. While the technique is widely used in the infrared waveband, it is less so for visible detectors.

 

This activity aims to continue the development of a large-format, high-performance visible hybrid detector array through the design and manufacture of a new ROIC and the fabrication and characterisation of a breadboard visible hybrid sensor. Such a detector would have a wide range of applications both Earth observation, astronomy and planetary applications.

The main tasks of the activity are Review and consolidation of requirements, Preliminary detector design, Detailed detector design, Test equipment and test plan preparation, Detector manufacture, Detector characterization and Future roadmap preparation.